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Address:Flat 2, 5th Floor, Block 6, LongBi Industrial Park 27 Dafa Road, BanTian Region, LongGang District, ShenZhen GuangDong Province, China

Fax:0755-23609322

Tel:13510562650

Mailbox:info@argo-tec.com

Desktop dispensing robot (Ball screw) PC AR-SC series
Desktop dispensing robot (Ball screw) PC AR-SC series

AR-SC series desktop dispensing robot adopts precision ball screw module and servo motor drive technology, and cooperates with powerful visual recognition dispensing software to realize high-speed and precise dispensing process. 

Hotline: 13510562650
Detail intruduction:

Features

● Powerful visual Functions

    Template matching

    Edge recognition

    Multiple sets of auxiliary mark programming

    1.3 Mpixels camera


● High-precision motion control

    Servo motor

    High-precision ball screw module


● Optional functions

    ◆Laser height sensor

    ◆Needle position calibration

    ◆Low liquid level detector

    ◆Nozzle cleaner


Specifications

Specification

AR-300SC

AR-400SC

AR-500SC

Stroke range (X/Y/Z)

255mmx300mmx80mm

355mmx400mmx80mm

455mmx500mmx80mm

Position resolution

0.001mm※

Position repeatability

±0.01mm※

Maximum speed

X/Y:=600mm/s; Z=500mm/s

Camera 

1.3 Mpixels

Maximum acceleration

X/Y:0.6g;Z:0.3g

Payload

Z axis: 5kg, work-holder: 15kg

Motion system

Servo motor & ball screw

Control System

PC

Software function

Vision fiducial and inspection, batch programming, matrix duplicate, height inspection, CAD input, Fids-on-the-fly and Jet on-the-fly

Dimensions (L/W/H)

573mmx578mmx592mm

673mm*678mm*592mm

773mm*778mm*592mm

Optional

Laser height sensor, Needle position calibration, Low liquid level detector, Nozzle cleaner

※ Using laboratory test method.


Typical applications

●Camera modules assemblyDesktop dispensing robot (Ball screw) PC AR-SC series

     ◆VCM

     ◆Lens Fixing

     ◆Lens Holder Adhesive Dispensing

     ◆Flip-chip Underfill for Image Sensor


●Fingerprint recognition

    ◆IC encapsulation

    ◆Chip underfill

    ◆Metal frame bonding


●Smart phone assembly

    ◆Sealing for Cover Frame

    ◆Chip Encapsulation and Underfill for FPC Assembly


Acoustics Devices

    ◆Ear Phone, Speaker and Microphone Assembly

    ◆Speaker Frame and Membrane Assembly

    ◆Coil Assembly

  

MEMS

    ◆Au Wire Encapsulation

    ◆Solder Paste Acoustical Seal

 

Vibration Motor

    ◆Lids sealing

    ◆Weld pad protection


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