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Tel:13510562650

Mailbox:info@argo-tec.com

Inline automatic high-speed dispensing robot AI series
Inline automatic high-speed dispensing robot AI series

The AI series automatic dispensing robot adopts a compact structure design. It has two different motion control system: servo motor & precision ball screw and high-speed linear motor & grating ruler. It can be freely equipped with non-contact pneumatic jet valve,piezoelectric jet valve, screw valve, screw pump and other dispensing equipment to meet various complex dispensing process requirements.

Hotline: 13510562650
Detail intruduction:

● Optional functions

    ◆Laser height sensor

    ◆Needle position calibration

    ◆Low liquid level detector

    ◆Nozzle cleaner


Features

● High-precision dispensing system

● High-precision motion control

● High-precision vision software

● Integrated structure design, compact and stable structure, high reliability

● Universal design, can be matched with various valves to adapt to various process applications

● Modular design, easy to add various optional functions

    ◆Dual valve

    ◆Dual transmission track

    ◆Bottom heating

    ◆Tilt dispensing

    ◆Weighing calibration function

    ◆Laser height sensor

    ◆Needle position calibration

    ◆Low liquid level detector

    ◆Nozzle cleaner


Dual valve

●Synchronous double valve: The two valves work at the same time, which greatly saves dispensing time and 在线式全自动高速点胶机AI系列

  improves production efficiency

●Asynchronous double valve: The two valves work separately, which can make two kinds of glue or processes 

  completed in the same equipment


Dual transmission track

Reduce waiting time and improve production efficiency在线式全自动高速点胶机AI系列

●Different tracks can achieve different production process requirements

●The second track can be used to reflow fixtures



Bottom heating

Can speed up the penetration of glue and improve production efficiency在线式全自动高速点胶机AI系列

Various heating or multi-stage heating can be used



Inclined dispensing

Able to achieve ±45 degree Inclined dispensing在线式全自动高速点胶机AI系列

Able to meet the dispensing requirements with overflow glue width less than 0.3mm




Specifications

Specification

  AI-800

AI-630

AI-430

Dimensions(W x D x H)

  750mm x 1200mm x 1500mm

  650mm x 1200mm x 1500mm

  600mm x 1000mm x 1500mm

Motion system

X/Y: Servo motor Linear motor     

     Z: Servo motor Ball screw

Servo motor Ball screw

Servo motor Ball screw

Travel (X,Y&Z)

  400mm×650mm×50mm

  300mm×600mm×50mm

  300mm×400mm×100mm

Dispensing area

  W x D =350mm x 500mm

  W x D =250mm x 450mm

  W x D =250mm x 300mm

Min. substrate size

  W x D =50mm x 50mm

  W x D =50mm x 50mm

  W x D =50mm x 50mm

Track height

 890~965mm

  890~965mm

 890~930mm

Track payload (including fixture)

  3kg

  3kg

  3kg

Substrate thickness

  0.5mm<T<8mm

  0.5mm<T<8mm

  0.5mm<T<8mm

Clip width

  4±2mm

  4±2mm

10±2mm

Max. track transfer speed

  300mm/s,Flat belt transmission

  300mm/s,Flat belt transmission

  300mm/s,Flat belt transmission

Orbital conveying direction

 Left in and right out, right in and left out

 Left in and right out, right in and left out

  Left in and right out, right in and left out

Positioning accuracy

  ±20μm@3σ(X,Y),±10μm@3σ(Z)

  ±30μm@3σ(X,Y),±10μm@3σ(Z)

  ±30μm@3σ(X,Y),±20μm@3σ(Z)

Position Repeatability

  ±10 μm@3σ(X,Y),±5μm@3σ(Z)

  ±15 μm@3σ(X,Y),±5μm@3σ(Z)

  ±15 μm@3σ(X,Y),±10μm@3σ(Z)

Max. speed

  1500 mm/s (X,Y)

  1000 mm/s (X,Y)

  800 mm/s (X,Y)

Max. acceleration

  1.5g(X,Y)

  1g(X,Y)

  0.8g(X,Y)

Max.substrate size(single track)

350mm x 500mm

 250mm x 450mm

250mm x 300mm

Max. substrate size(dual track)

350mm x 230mmx230mm

None

None

Max. substrate component height

20mm

20mm

                         


Typical applications

●Camera modules assemblyInline automatic high-speed dispensing robot AI series

     ◆VCM

     ◆Lens Fixing

     ◆Lens Holder Adhesive Dispensing

     ◆Flip-chip Underfill for Image Sensor


●Fingerprint recognition

    ◆IC encapsulation

    ◆Chip underfill

    ◆Metal frame bonding


●Smart phone assembly

    ◆Sealing for Cover Frame

    ◆Chip Encapsulation and Underfill for FPC Assembly


Acoustics Devices

    ◆Ear Phone, Speaker and Microphone Assembly

    ◆Speaker Frame and Membrane Assembly

    ◆Coil Assembly

  

MEMS

    ◆Au Wire Encapsulation

    ◆Solder Paste Acoustical Seal

 

Vibration Motor

    ◆Lids sealing

    ◆Weld pad protection


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