Your current location:HomeProductsJet valve

Product

Contact Us

Address:No. 2, 5th Floor, Building 6, Longbi Industrial Zone, No. 27, Dafa Road, Bantian Street, Longgang District, Shenzhen, Guangdong, China

Fax:0755-28893956

Tel:13510562650

E-mail:info@argo-tec.com

Piezoelectric jet valve AV-8500
Piezoelectric jet valve AV-8500

AV-8500 is a dual piezoelectric jet valve. The opening and closing of the needle are controlled by piezoelectric ceramics, which has a faster response speed and higher control accuracy. Compared with a single piezoelectric valve, its actual upper limit frequency will be higher, and the jet force will be greater, which has the advantage of dispensing high-viscosity glue. The initial position of the needle can be adjusted by the differential head to compensate for changes in the stroke caused by wear.It is suitable for epoxy, UV, silicone, acrylic, conductive silver glue, tuffy glue ,etc. 

Hotline: 13510562650
Detail intruduction:

Features

● Non-contact dispensing, z-axis motion was eliminated

● High speed jetting, up to 1000 dots per second

● High accuracy, high repeatability

● Capable of handling most commonly used fluids

● Wide range of viscosity

● User friendly operation, easy cleaning

● Min. dot size of approx. 150um

● Specified seal ring design for high life

● Self protection for over heating of piezoelectric stack


Specifications

● Dimensions(LxDxH): 110mmx90mmx14mm

● Net weight: 0.59Kg

● Working Frequency: Max.1000Hz

● Min. dot size: 150μm

● Min. dispensing volume: 1~2nl

● Nozzle diameter: 0.05mm to 0.6mm

● Fluid pressure: Max.0.5Mpa

Need to be used with controller AJC-56.


AJC-56 Specifications

● Dimensions(LxDxH): 288mmx148mmx138mm压电喷射阀AV-8500

● Net weight: 2.5Kg

● Power: 220V±10%/50HZ

● Trigger input: 24V pulse or short circuit signal

● Min. valve open/close time: 0.1ms

● Min. rise/fall time: 0.1ms

● Heating temperature tolerance: ±1℃

● Communication interface: RS232


Typical application

● Assembly of mobile devices and wearable products压电喷射阀AV-8500

● Flip-chip and BGA underfill (underfill)

● Die bonding

● Conformal Coating

● Lens Fixing of the camera module

● Encapsulation

● Surface Mounted Package

● Fingerprint recognition module

● Mini-LED

● Outdoor LED

● MEMS

● Bonding of inductance cover

● Conductive silver paste


Related Products