● Optional functions
◆Laser height sensor
◆Needle position calibration
◆Low liquid level detector
◆Nozzle cleaner
Features
● High-precision dispensing system
● High-precision motion control
● High-precision vision software
● Integrated structure design, compact and stable structure, high reliability
● Universal design, can be matched with various valves to adapt to various process applications
● Modular design, easy to add various optional functions
◆Dual valve
◆Dual transmission track
◆Bottom heating
◆Tilt dispensing
◆Weighing calibration function
◆Laser height sensor
◆Needle position calibration
◆Low liquid level detector
◆Nozzle cleaner
Dual valve
●Synchronous double valve: The two valves work at the same time, which greatly saves dispensing time and
improves production efficiency
●Asynchronous double valve: The two valves work separately, which can make two kinds of glue or processes
completed in the same equipment
Dual transmission track
●Reduce waiting time and improve production efficiency
●Different tracks can achieve different production process requirements
●The second track can be used to reflow fixtures
Bottom heating
●Can speed up the penetration of glue and improve production efficiency
●Various heating or multi-stage heating can be used
Inclined dispensing
●Able to achieve ±45 degree Inclined dispensing
●Able to meet the dispensing requirements with overflow glue width less than 0.3mm
Specifications
Specification | AI-800 | AI-630 | AI-430 |
Dimensions(W x D x H) | 750mm x 1200mm x 1500mm | 650mm x 1200mm x 1500mm | 600mm x 1000mm x 1500mm |
Motion system | X/Y: Servo motor & Linear motor Z: Servo motor & Ball screw | Servo motor & Ball screw | Servo motor & Ball screw |
Travel (X,Y&Z) | 400mm×650mm×50mm | 300mm×600mm×50mm | 300mm×400mm×100mm |
Dispensing area | W x D =350mm x 500mm | W x D =250mm x 450mm | W x D =250mm x 300mm |
Min. substrate size | W x D =50mm x 50mm | W x D =50mm x 50mm | W x D =50mm x 50mm |
Track height | 890~965mm | 890~965mm | 890~930mm |
Track payload (including fixture) | 3kg | 3kg | 3kg |
Substrate thickness | 0.5mm<T<8mm | 0.5mm<T<8mm | 0.5mm<T<8mm |
Clip width | 4±2mm | 4±2mm | 10±2mm |
Max. track transfer speed | 300mm/s,Flat belt transmission | 300mm/s,Flat belt transmission | 300mm/s,Flat belt transmission |
Orbital conveying direction | Left in and right out, right in and left out | Left in and right out, right in and left out | Left in and right out, right in and left out |
Positioning accuracy | ±20μm@3σ(X,Y),±10μm@3σ(Z) | ±30μm@3σ(X,Y),±10μm@3σ(Z) | ±30μm@3σ(X,Y),±20μm@3σ(Z) |
Position Repeatability | ±10 μm@3σ(X,Y),±5μm@3σ(Z) | ±15 μm@3σ(X,Y),±5μm@3σ(Z) | ±15 μm@3σ(X,Y),±10μm@3σ(Z) |
Max. speed | 1500 mm/s (X,Y) | 1000 mm/s (X,Y) | 800 mm/s (X,Y) |
Max. acceleration | 1.5g(X,Y) | 1g(X,Y) | 0.8g(X,Y) |
Max.substrate size(single track) | 350mm x 500mm | 250mm x 450mm | 250mm x 300mm |
Max. substrate size(dual track) | 350mm x 230mmx230mm | None | None |
Max. substrate component height | 20mm | 20mm | |
Typical applications
●Camera modules assembly
◆VCM
◆Lens Fixing
◆Lens Holder Adhesive Dispensing
◆Flip-chip Underfill for Image Sensor
●Fingerprint recognition
◆IC encapsulation
◆Chip underfill
◆Metal frame bonding
●Smart phone assembly
◆Sealing for Cover Frame
◆Chip Encapsulation and Underfill for FPC Assembly
●Acoustics Devices
◆Ear Phone, Speaker and Microphone Assembly
◆Speaker Frame and Membrane Assembly
◆Coil Assembly
●MEMS
◆Au Wire Encapsulation
◆Solder Paste Acoustical Seal
●Vibration Motor
◆Lids sealing
◆Weld pad protection